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Power chips are connected to external circuits via product packaging, and their performance depends upon the support of the packaging. In high-power circumstances, power chips are generally packaged as power components. Chip interconnection refers to the electrical connection on the top surface area of the chip, which is typically aluminum bonding wire in standard modules. ^
Typical power component bundle cross-section

Today, business silicon carbide power components still mainly utilize the packaging innovation of this wire-bonded traditional silicon IGBT component. They deal with issues such as big high-frequency parasitic parameters, inadequate warm dissipation capability, low-temperature resistance, and insufficient insulation toughness, which limit making use of silicon carbide semiconductors. The screen of excellent performance. In order to resolve these issues and completely make use of the substantial prospective benefits of silicon carbide chips, lots of new product packaging technologies and options for silicon carbide power modules have actually arised in the last few years.

Silicon carbide power module bonding approach

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have actually developed from gold cable bonding in 2001 to aluminum cord (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually established from gold cables to copper cords, and the driving pressure is price decrease; high-power devices have actually created from aluminum wires (strips) to Cu Clips, and the driving pressure is to boost product performance. The higher the power, the greater the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that utilizes a solid copper bridge soldered to solder to link chips and pins. Compared to traditional bonding product packaging methods, Cu Clip technology has the complying with benefits:

1. The connection between the chip and the pins is made from copper sheets, which, to a specific level, changes the common cord bonding technique between the chip and the pins. For that reason, an unique package resistance value, higher existing flow, and far better thermal conductivity can be obtained.

2. The lead pin welding location does not need to be silver-plated, which can totally conserve the cost of silver plating and bad silver plating.

3. The item appearance is entirely consistent with normal products and is primarily used in servers, portable computers, batteries/drives, graphics cards, motors, power products, and various other fields.

Cu Clip has 2 bonding approaches.

All copper sheet bonding method

Both eviction pad and the Source pad are clip-based. This bonding approach is extra costly and intricate, however it can attain much better Rdson and better thermal effects.

( copper strip)

Copper sheet plus wire bonding technique

The resource pad uses a Clip approach, and eviction uses a Wire method. This bonding technique is slightly cheaper than the all-copper bonding technique, conserving wafer area (suitable to very small gate areas). The procedure is less complex than the all-copper bonding approach and can obtain better Rdson and far better thermal effect.

Supplier of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding alpha copper, please feel free to contact us and send an inquiry.

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